Alan V. Ricolcol

PERMANENT ADDRESS: San Sebastian, San Vicente, Ilocos Sur
Contact #: 09306523091
E-mail add: [email protected]

OBJECTIVES:
Desire a position that will allow me to use my skills in the field of Technology and Semiconductor in an organization that provides a balanced work-life environment.

PERSONAL INFORMATION:
Name: Alan V. Ricolcol
Civil Status: Married
Citizenship: Filipino
Gender: Male
Present Address: San Francisco, Mabalacat, Pampanga
Religion: Roman Catholic
Age: 30
Date of Birth: July 08, 1987
Place of Birth: San Sebastian, San Vicente, Ilocos Sur
Height: 5’5” Weight: 140lbs. Language: Ilocano, Tagalog, English

EDUCATIONAL BACKGROUND:

Tertiary: University of Northern Philippines Tamag, Vigan City
Bachelor of Science in Industrial Technology Major in Electronics 2005-2009

Secondary: Ilocos Sur National High School Vigan, City 2000-2004

Primary: San Sebastian Elementary School March 2000

WORK EXPERIENCE :

TEXAS INSTRUMENT INC.
2011-present
Assigned at QFN Die Bond area as Sr. Equipment Technician
Texas Instrument Philippines Inc. Clark Pampanga

Pythos Technology Inc.
Assigned at QFN Die Bond area as Equipment Technician
Texas Instrument Philippines Inc. Clark Pampanga
Sept. 2009-May 2011

OJT and APPRENTICE – 2008-2009
November 17, 2008 to April 17, 2009 (OJT)
April 17, 2009 to September 17, 2009 (Apprentice)
TEXAS INSTRUMENT INC. BAGUIO CITY
Assigned at Ball Attach area as Equipment Technician

FUNCTIONS:

Line Support, Sustaining,

Preventive Maintenance

Major conversion and minor set-up

MACHINE HANDLED:

SPA 300&400, DIE BONDER

BESTEM DO1 D02 ,D15 DIE BONDER

ASM AD8312 , AD8312 PLUS ,AD838 DIE BONDER

PRIMARY FUNCTION
Responsible in performing electronics, electrical and mechanical troubleshooting to determine

problems in non-functioning electro-mechanical equipment used in the manufacturing line of

Assembly Operations (IC-Integrated Circuits).

Major Duties and Responsibilities

1. Dismantles, adjust, and repairs manufacturing equipment’s.

2. Uses test and diagnostic tools or equipment to perform checkouts.

3. Performed Preventive Maintenance

4. Makes use of engineering methodologies and new technology to diagnose equipment and

standardize it.

5. Enhances the reliability, extends the life and suppress failure of pats and

equipment.

6. Pursues economy in the above activities and optimize them.

7. Equipment Engineering support.

8. Process and Operates Die Attach like

QFN Large lead Frame, Die attach film(DAF), QFN standard lead frame, B-stage device.

SEMINARS, CONFERENCE, TECHNICAL TRAININGS ATTENEDED

1.TS16949 Orientation/Awareness training

2.Environment Management system ISO141001

3.100K Class Clean room training

4.Electrostatic Discharge (ESD)

5.Total Productive Maintenance (TPM)

6.Clean Factory Training

7.TI Manufacturing Process Flow

8. Radiation Safety Training

9. Basic Environmental, Safety and Health Training

10. Electrical Safety Training

CHARACTER REFERENCE:

ALLAN MICHAEL FULMER
Equipment Engineer TI QFN DIE BOND
09267817040

Mcline Ronquillo
Equipment Engineer STMicroelectronics
09186943665

ARNOLD MERCADO
Equipment Technician TI QFN DIE BOND
09772820304

I hereby certify that the above information has been accomplished in good faith, verified by me and to the best knowledge is true, correct and complete statement.

Alan Ricolcol

Applicant’s Signature