OBJECTIVE
Seeking to work in a progressive company that promotes growth for an individual, and
provides an opportunity to capitalize my skills and abilities in the field of Engineering that would make
me become a professional of excellent repute that effectively contributes towards the goal of the
company.
WORK EXPERIENCE
TEXAS INSTRUMENTS Clark, Pampanga
Equipment Engineer – Wafer Level Chip Scale Package (WCSP) Backend (July 2017 – Present)
Hands on experience in installing, maintaining, operating, and testing Front of Line tools.
– EO Laser Marking (CSM2000, CSM3000, CSM3002FC): Advance level learning, Machine
Operation, Tool Maintenance, Troubleshooting, Calibration, Robot and Aligner Teaching,
Recipe Generation, Detailed Parameter Optimization, Output Improvement, and Tool Qual.
– LINTEC Backside Coat (RAD-3600): Machine Operation, Tool Maintenance, Parameter
Optimization, Troubleshooting, and Tool/ Material Qual.
– BLUEM Oven Cure (DCW-1406-G): Machine Operation, Tool Maintenance, Parameter
Optimization, Controller Programming, Troubleshooting, and Tool/ Material Qual.
– DISCO Backgrinding (DGP8760/ DGP8761): Recipe Generation, Parameter Response
– Wafer Saw (DISCO DFD6361/ DFD6362; ACCRETECH 300TX): Basic Concept, Model
Data, and Recipe Generation
Performing improvement projects to enhance machine stability and capability to eliminate
tool related issues.
Deep dive on machine and product issues through detailed analysis to identify real root
cause and implement concrete actions to avoid repeats.
Improved tool maintenance through implementing early detection and control programs as
aligned with quality sensitivity awareness.
Meets with OEM to improve/enhance machine performance and upgrade machine capability
TEXAS INSTRUMENTS Clark, Pampanga
Process Engineer – Wafer Level Chip Scale Package (WCSP) Backend (July 2015 – July 2017)
Performing line sustaining activities to ensure smooth flow of production materials through
proper verification and disposition based on specification requirements. Aiding as well all
Manufacturing needs to continuously process materials through recipe generation,
parameter optimization, KPARM population, and other line sustaining activities.
Performing improvement projects/ activities through detailed analysis to reduce quality
issues, hold lots disposition, and line sustaining activities.
Uses the following tools as essential for implementing controls and problem solving
techniques – SPC charts control, MSA, 7 QC tools, Statistical Analysis, SQL, and Spotfire.
Studied wide range of material properties from metals, polymers, composite materials upto advanced development of materials such as smart, nano materials, etc.
Semiconductor manufacturing experience for Wafer Level Chip Scale Package (Backend) for both Process and Equipment Engineering Team